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本文论述了在我国目前现有器件水平条件下,整机研究所根据实际需要,利用现有设备对整机可靠性影响较大的重点器件进行一些力所能及的现场失效分析的重要意义,金相学在电子器件失效分析中的应用.通过对3DK7、3DD102D、YS1000A1.Cμs、GVF等器件现场失效分析实例说明,不仅能解决我所科研生产中的一些实际问题,而且把这些现场失效资料反馈回有关元器件厂后也有利于提高元器件的质量.
This paper discusses the significance of the field failure analysis that can be performed by the whole machine institute under the condition of the current device level in our country according to the actual needs and using the existing equipment to influence the reliability of the whole machine. The application of device failure analysis.Through the example of on-site failure analysis of 3DK7, 3DD102D, YS1000A1.Cμs, GVF and other devices, not only can solve some practical problems in our research and production, but also feedback these field failure data back to related components After the factory is also conducive to improving the quality of components.