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超声波检测是一种非常重要的无损检测方法,能灵敏地探测塑封器件的内部缺陷。分别在超声波扫描的单点扫描工作模式、截面扫描工作模式、层扫描工作模式和穿透式扫描工作模式下,结合X光检测技术对霍尔电路元器件进行了检测。分析了霍尔电路器件超声波扫描检测结果中出现内部分层问题的主要因素,提出了利用超声波扫描检测技术对大批量元器件进行筛选检测时需要注意的问题。分析结果对提高塑封元器件可靠性具有一定的指导意义。
Ultrasonic testing is a very important nondestructive testing method, which can sensitively detect the internal defects of plastic parts. The Hall circuit components were tested with X-ray detection technology under single-point scan mode, cross-section scan mode, layer scan mode and transmissive scan mode respectively. The main factors that cause internal stratification problems in the ultrasonic scanning test results of Hall circuit devices are analyzed. Some problems that need attention are pointed out when using ultrasonic scanning technology to screen and inspect large quantities of components. The results of the analysis have some guiding significance to improve the reliability of plastic components.