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通过透射电子显微技术研究了25、100和200mg/kgCu对小麦幼苗根尖和叶片细胞超微结构的损伤。结果表明:25、100和200mg/kgCu均对小麦幼苗细胞造成明显损伤。Cu胁迫导致根尖和叶片细胞产生质壁分离,细胞质浓缩;叶绿体膨胀,片层结构紊乱,被膜消失,解体;线粒体结构模糊,空泡化等。Cu胁迫浓度与对小麦细胞超微结构的损伤程度呈一定的正相关性,且Cu对细胞各部位或各细胞器的损害程度不同,其中线粒体对Cu反应最为敏感,而不同部位的细胞器对Cu的耐性反应也存在一定差异。
Transmission electron microscopy was used to investigate the effects of 25, 100 and 200 mg / kg Cu on the ultrastructure of root and leaf cells of wheat seedlings. The results showed that 25, 100 and 200 mg / kg Cu all caused obvious damage to wheat seedling cells. Cu stress resulted in the separation of plasmids from the apical and leaf cells, and the cytoplasm was concentrated. The chloroplast was swollen, the lamellar structure was disorganized, the membrane disappeared and disintegrated, and the mitochondrial structure was vague and vacuolated. There was a positive correlation between concentration of Cu stress and the degree of damage to ultrastructure of wheat cells, and Cu had different degrees of damage to various parts of the cells or various organelles. Among them, mitochondria were the most sensitive to Cu reaction, There are some differences in patience.