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以三层封装器件为对象,利用ANSYS软件对不同湿度环境下,湿气在器件封装中的扩散行为,以及经过干燥处理后,湿气的残余现象进行分析,以期获得湿气对器件可靠性的影响,从而为提高整体性能研究提供依据。
Taking the three-layer package device as object, the diffusion behavior of moisture in the device package under different humidity environment and the residual phenomenon of moisture after drying process were analyzed with ANSYS software in order to obtain the reliability of moisture on the device Influence, so as to improve the overall performance of research provide the basis.