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针对硅基底微带天线的缺陷,结合MEMS技术的体微加工技术和表面微加工技术对基底材料进行处理,以达到改善天线性能的目标。设计了一种MEMS层叠式硅基底与介质型光子晶体相结合的新型微带天线。最后利用HFSS14.0对该结构进行仿真。结果表明,该结构天线的相对带宽达到23%且天线的回波损耗为–41 dB,相对于普通硅基底天线的相对带宽4%和回波损耗–14.5 dB有了明显改善。
In order to improve the performance of the antenna, aiming at the defects of the microstrip antenna on the silicon substrate, the micromachining technology and surface micromachining technology combined with MEMS technology are used to process the substrate material. A novel microstrip antenna combining MEMS stacked silicon substrate and dielectric photonic crystal was designed. Finally, the structure is simulated by HFSS14.0. The results show that the relative bandwidth of the structure antenna is 23% and the return loss of the antenna is -41 dB, which is obviously improved compared with 4% of the relative bandwidth and -14.5 dB of the return loss of the common silicon substrate antenna.