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1 Prismark公司姜旭高发表《FPC Market Opportunities and Challengies》演讲2日本MEKTORN松本博文博士发表《The Advanced FPC Technology and Market Trend》演讲3东洋化工株式会社长谷川直树发表《FPC行业高频材料展望》演讲4苏州维信电子有限公司黄业弘发表《高密度互连软板的制造技术开发》演讲5中国覆铜板行业协会祝大同发表《挠性覆铜板行业市场前景分析》演讲6珠海元盛电子科技股份有限公司宋二华发表《挠性板阻抗与损耗》演讲
1 Prismark company Jiang Xuge presented “FPC Market Opportunities and Challengies” speech 2 Japan MEKTORN Dr. Matsumoto Bowen delivered “The Advanced FPC Technology and Market Trend” speech 3 Toyo Chemical Co., Ltd. Hasegawa Naoki published “FPC Industry High Frequency Materials Outlook” speech 4 Xuzhou Weixin Electronics Co., Ltd. Huang Yuedong published “manufacturing technology development of high-density interconnection soft board” speech 5 Chinese CCL industry association Zhu Datong published “flexible CCL industry market prospect” speech 6 Zhuhai yuan Sheng Electronic Technology Co., Ltd. Song Erhua published “flexible plate impedance and loss” speech