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针对带有常规的第一类反光杯的基板结构因受限于封装引线键合工艺而反光杯尺寸较小的情况,通过光学理论分析了其存在反射光线不完全的问题,提出在LED模组芯片间开设第二类反光结构的解决方案。并基于光学分析软件Tracepro的仿真研究,验证了其有效性。在此基础上设计了新型包含两类反光杯的基板结构,最高可使LED模组出光效率和中心光强与没有开反光杯的情况相比提升近23%和38%。
Aiming at the problem that the substrate structure with the conventional first-type reflector cup is limited in size by the bonding wire bonding process of the package, the problem of incomplete reflected light exists according to the optical theory, and the problem that the LED module Chip set up the second type of reflective structure solution. And based on the simulation analysis of optical analysis software Tracepro, its validity is verified. Based on this, a new type of substrate structure with two kinds of reflector cups is designed, which can raise the output efficiency and center light intensity of the LED module up to 23% and 38% compared with the case without the reflector cup.