重点介绍了在微机械加工中碰到的带图形硅片键合工艺，测量了不同表面处理和不同退火条件下的表面能，估算了封闭腔内的剩余压力和腔体薄壁的形变。这对研制和开发新颖的微机械结构提供了一种重要的途径 This paper mainly introduces the bonding process of the patterned silicon wafer which is encountered in the micromachining. The surface energy under different surface treatments and different annealing conditions is measured. The residual pressure in the closed cavity and the deformation of the thin wall of the cavity are estimated. This provides an important avenue for the development and development of novel micromechanical structures