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由Chomerics公司（位于麻省的Woburn）开发的PowerSite,是一种用于功率半导体晶体管的自动化连接技术。应用该项技术可以有选择地将绝缘处理后的铜垫片键合到铝散热器上去。应用此项技术可以不再需要使用其他的机械紧固装置,以及其他的相关硬件;并且所获得的热阻还比通常的安装方式低。 每个铜垫片的接触热阻可以低达0.1℃-in.2/W;而通常使用合成橡胶垫片所能够获得的热阻,高达0.4℃-in.2/
PowerSite, developed by Chomerics Inc. (Woburn, MA), is an automated connection technology for power semiconductor transistors. Application of this technology can be selectively insulated copper pads after bonding to the aluminum radiator up. The use of this technology eliminates the need to use other mechanical fastening devices, as well as other related hardware; and achieves lower thermal resistance than typical installations. The thermal contact resistance of each copper pad can be as low as 0.1 ° C-in. 2 / W; however, the thermal resistance typically achieved with synthetic rubber gaskets as high as 0.4 ° C.-in. 2 /