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数值分析了大功率半导体激光器模块的散热特性及温度场,以及焊料、热沉、导热胶和冷水板温度等参数对芯片内部最高温度的影响。结果表明,焊料厚度小于24μm时,其导热系数对芯片内部最高温度影响较弱,无高阻层形成;芯片内部最高温度随着热沉长或宽尺寸及导热系数的增大,呈指数形式下降,随着热沉厚度的增大呈对数形式升高;当导热胶导热系数大于20W/(m·K)、厚度小于30μm时,芯片温度趋于稳定;冷水板温度与芯片内部最高温度呈比例系数为1的线性相关性。根据分析结果提出了激光器封装部件的尺寸、导热系数或材料的设计和选择原则。
Numerical analysis of the high-power semiconductor laser module cooling characteristics and temperature field, as well as solder, heat sink, thermal glue and cold water temperature and other parameters of the chip maximum temperature. The results show that when the thickness of solder is less than 24μm, the thermal conductivity has little effect on the maximum internal temperature of the chip and no high-resistance layer is formed. The maximum temperature inside the chip decreases exponentially with the increase or decrease of the heat sink’s length, width and thermal conductivity , With logarithmic increase of heat sink thickness. When the thermal conductivity of thermal conductive adhesive is more than 20W / (m · K) and the thickness is less than 30μm, the chip temperature tends to be stable. The temperature of cold plate and the maximum internal temperature of chip A linear correlation with a scale factor of 1. According to the analysis results, the size, thermal conductivity or material design and selection principle of laser package are proposed.