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使用AgCu28钎料多次钎焊无氧铜和其他材料时,极易造成无氧铜母材性能下降.为解决此问题,针对采用AgCu28钎料焊接的无氧铜-无氧铜、无氧铜-镀镍不锈钢和无氧铜-蒙乃尔3种钎焊接头的微观组织进行观察,发现无氧铜-无氧铜的钎焊接头中钎料与焊缝结合紧密,接头组织良好;而无氧铜-镀镍不锈钢和无氧铜-蒙乃尔的钎焊接头中AgCu28钎料沿着无氧铜晶界进行扩散,即出现明显的晶界渗透现象.成分检测表明,含Ni母材中的Ni元素在钎焊过程中快速溶解进钎料,经分析认为Ni元素在钎料中的溶解是导致钎料对无氧铜产生晶界渗透的主要原因.
The use of AgCu28 solder brazing several times oxygen-free copper and other materials, can easily lead to oxygen-free copper base metal performance degradation.To solve this problem, for the use of AgCu28 solder brazing oxygen-free copper - oxygen-free copper, oxygen-free copper - Nickel-plated stainless steel and oxygen-free copper - Monel 3 kinds of brazing joint microstructure was observed and found that oxygen-free copper - oxygen-free copper brazing joint with the solder and weld close, well joint organization; and no oxygen AgCu28 brazing filler metal diffused along the oxygen-free copper grain boundaries in the copper-nickel-plated stainless steel and oxygen-free copper-monel brazing joints, that is, obvious grain boundary permeation occurred.The composition tests showed that Ni Elements in the brazing process quickly dissolved into the brazing filler metal, the analysis that the Ni element in the brazing filler metal dissolution is the leading cause of oxygen-free copper grain boundary penetration of the main reasons.