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采用大塑性变形法(SPD)制备出了集成电路用纳米晶材料,同时利用透射电子显微镜(TEM)及电子万能试验机对不同SPD方法生产的Cu-Al合金进行微结构分析及拉伸性能试验。结果表明:层错能是影响纳米晶Cu-Al合金微观结构与拉伸性能的关键性因素,纳米晶Cu-Al合金的微观结构形成机制,平均晶粒尺寸以及强塑性匹配程度均随着层错能的降低而发生改变。
The nanocrystalline materials for integrated circuits were prepared by the method of plastic deformation (SPD). The microstructures and tensile properties of Cu-Al alloys produced by different SPD methods were also studied by transmission electron microscopy (TEM) and electronic universal testing machine . The results show that the stacking fault energy is the key factor that affects the microstructure and tensile properties of the nanocrystalline Cu-Al alloy. The microstructure formation mechanism, the average grain size and the degree of strong plastic matching of the nanocrystalline Cu-Al alloy all depend on the layer The error can be reduced and changed.