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研究了以正硅酸乙酯(TEOS)、三氯生和γ-氨丙基三乙氧基硅烷(KH-550)为原料制备的缓释型有机/无机复合抗菌材料的耐热性能。采用SEM、FTIR和DSC/TG等方法表征了样品的颗粒形貌、表面基团和热稳定性,通过抑菌圈实验表征了经灼烧后样品的溶出抗菌性。研究发现,该有机/无机复合抗菌材料具有较好的耐热性能,于200℃加热30 min可大部分保留其抗菌性能。将该样品用于粉末涂料中,获得了抗菌率>99%的粉末涂料涂层。
The heat resistance of sustained-release organic / inorganic composite antibacterial materials prepared from TEOS, triclosan and γ-aminopropyltriethoxysilane (KH-550) was studied. The morphology, surface groups and thermal stability of the samples were characterized by SEM, FTIR and DSC / TG. The antibacterial properties of the samples after ignition were characterized by inhibition zone experiments. The study found that the organic / inorganic composite antimicrobial material has good heat resistance, at 200 ℃ for 30 min can retain most of its antibacterial properties. Using this sample in a powder coating, a powder coating coating with an antimicrobial rate> 99% was obtained.