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随着半导体技术的发展,封装集成度不断提高,迫切需要发展一种低温封装与键合技术,满足热敏器件封装和热膨胀系数差较大的同质或异质材料间的键合需求。针对现有整体加热封装技术的不足,首先介绍了局部加热封装技术的原理与方法,然后对电流加热、激光加热、微波加热、感应加热和反应加热等几种局部加热封装技术进行了比较分析,最后具体介绍了局部加热封装技术在热敏器件封装、MEMS封装和异质材料集成等方面的应用。由于局部加热封装技术具有效率高、对器件热影响小等优点,有望在MEMS技术、系统封装(SiP)、三维封装及光电集成等领域得到广泛应用。
With the development of semiconductor technology, packaging integration continues to increase, there is an urgent need to develop a low-temperature packaging and bonding technology to meet the bonding requirements of the thermal device package and the difference between the thermal expansion coefficient of heterogeneous or heterogeneous materials. Aiming at the insufficiency of the existing overall heating and packaging technology, the principle and method of partial heating packaging technology are introduced firstly. Then some local heating packaging technologies, such as current heating, laser heating, microwave heating, induction heating and reaction heating are compared and analyzed. Finally, it introduces the application of partial heating packaging technology in thermal device package, MEMS package and heterogeneous material integration. Due to its advantages of high efficiency and little thermal influence on the device, the partial heating packaging technology is expected to be widely used in the fields of MEMS technology, system packaging (SiP), three-dimensional packaging and optoelectronic integration.