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采用镍基中间层合金,在真空钼丝炉中对第二代镍基单晶高温合金DD6进行了瞬时液相扩散焊(TLP焊)连接,焊接温度为1200℃、保温时间为12h。用标准热处理制度对其接头进行热处理,分析了热处理工艺对接头组织的影响规律。结果表明,设计的中间层合金熔点在1084~1095℃范围,组织细小均匀,满足DD6单晶的扩散连接需要;TLP焊焊缝组织由γ相和γ′相组成,无片状共晶组织形成;焊缝金属与母材结合良好,经标准热处理后γ′相发生明显的晶粒长大和立方化,并以典型的立方形形貌均匀弥散地分布于基体之中,形成了微观结构理想的扩散连接接头。
The second generation Ni-based single crystal superalloy DD6 was connected by transient liquid phase diffusion bonding (TLP) in a vacuum molybdenum wire furnace at a welding temperature of 1200 ℃ and a holding time of 12h. The joints were heat-treated by standard heat treatment system, and the influence of heat treatment on the joint structure was analyzed. The results show that the designed intermediate layer alloy has the melting point in the range of 1084-1095 ℃ and the microstructure is fine and uniform, which meets the need of diffusion bonding of DD6 single crystal. The microstructure of TLP weld consists of γ phase and γ ’phase, and no eutectic microstructure is formed ; Weld metal and the base metal bond well, the γ ’phase after the standard heat treatment obvious grain growth and cube, and a typical cubic shape dispersed uniformly distributed in the matrix, the formation of the microstructure ideal Diffusion connector.