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1 Introduction MEMS technology is facing new challenges since thin wafer handling will be used more and more to archive smaller dies.Packaging the next device on the top of the first and so on called package on package(POP),first to reduce the wire bonding as the connections will be via through vias that run
1 Introduction MEMS technology is facing new challenges since thin wafer handling will be used more and more to archive smaller dies. Packaging the next device on the top of the first and so on called package on package (POP), first to reduce the wire bonding as the connections will be via vias that run