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采用电磁压制和粉末冶金技术相结合的方法制备了Ag40Cu23Zn31In4Ni2银基钎料箔片,分析了电磁压制中电压参数对压坯致密度的影响以及烧结工艺参数对烧结坯密度和显微组织的影响,并对该钎料的铺展润湿性进行了讨论。结果表明:随着放电电压的增加,Ag40Cu23Zn31In4Ni2银基钎料的压坯致密度呈上升逐渐变缓,最后下降的趋势,在1300 V获得最高致密度81.85%;当烧结时间一定时,在一定的烧结温度范围内,随着温度升高,烧结坯致密度提高;而烧结温度一定时,随着烧结时间增长,烧结坯致密度降低。润湿铺展性试验中发现:1300 V电压下压制的压坯在650℃温度下烧结0.5 h后获得的钎料箔片,其铺展面积可达到298.5 mm~2,具有良好的润湿性,能满足Ag40Cu23Zn31In4Ni2银基钎料的使用要求。该结果可为电磁压制制备无镉中温银基钎料新技术的工程应用提供理论和数据支持。
The Ag40Cu23Zn31In4Ni2 silver-based filler metal foil was prepared by a combination of electromagnetic pressing and powder metallurgy. The influence of the voltage parameters on the compact density and the influence of sintering parameters on the density and microstructure of the sintered compact were analyzed. The spreading wettability of the solder was discussed. The results show that with the increase of discharge voltage, the compact density of Ag40Cu23Zn31In4Ni2-based solder increases gradually and then decreases, and the maximum density reaches 81.85% at 1300 V. When the firing time is constant, With the increase of temperature, the density of sintered billet increases with the increase of sintering temperature. When the sintering temperature is constant, the density of sintered billet decreases with the increase of sintering time. Wetting spreadability test found that: sintered at 630 V for 0.5 h, the spreading area can reach 298.5 mm ~ 2, with good wettability, Meet Ag40Cu23Zn31In4Ni2 silver-based solder requirements. The results provide theoretical and data support for the engineering application of new technology of electromagnetic pressing for preparing cadmium-free silver-based solder.