现在塑料封装是集成电路(IC)的主要封装方式,而采用环氧树脂的低压传递模塑法又是塑料封装最普遍采用的方法。塑料封装方法分为液态树脂的灌铸法、预成形法、浸渍法和使用固态粒状树脂的低压传递模塑法。由 Nowadays, plastic package is the main package of integrated circuit (IC), and the low pressure transfer molding method using epoxy resin is the most commonly used method of plastic package. Plastic packaging methods are divided into liquid resin casting method, pre-forming method, impregnation method and the use of solid granular resin low pressure transfer molding method. by