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▲目前,镀金工艺已在生产中广泛应用。一般都是采用吊镀方法进行镀金。对于批量大的小型零件,吊镀不仅生产效率低、损耗大,而且质量差。为了改变这种状况,有的厂用滚镀工艺取代吊镀,克服了上述三个缺点。滚镀的主要设备有微型镀机和微型滚桶。工艺配方是:金4～6克/升,柠檬酸铵100～120克/升。工艺规范是:温度为室温,电流为0.1～0.2安/分米~2,氢离子浓度为5.3～5.8。阴极为含锑1%的金锑合金片。
▲ Currently, gold plating process has been widely used in production. Hanging plating methods are generally used for gold plating. For large quantities of small parts, hanging plating is not only inefficient production, loss, and poor quality. In order to change this situation, some factories have replaced the hanging plating with the barrel plating process, overcoming the above three shortcomings. The main equipment for barrel plating is micro plating machine and mini drum. Process formula is: gold 4 ~ 6 grams / liter, ammonium citrate 100 ~ 120 grams / liter. Process specifications are: temperature is room temperature, the current is 0.1 ~ 0.2 A / dm ~ 2, the hydrogen ion concentration is 5.3 ~ 5.8. The cathode is 1% antimony gold antimony alloy sheet.