For electronic packaging applications,Mo/Cu composites with volume fractions of 55%-67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniformly,and the Mo-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers,the densifications of the Mo/Cu composites are higher than 99%. The mean linear coefficients of thermal expansion(20-100 ℃) of Mo/Cu composites range from 7.9 to 9.3×10-6/℃ and decrease with increasing volume fraction of Mo. The experimental coefficients of thermal expansion agree well with predicted values based on Kerner’s model. The thermal and electric conductivities of Mo/Cu composites are in range of 220-270 W/(m·℃) and 22-28 MS/m,respectively,and decrease with increasing volume fraction of Mo. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity,which are obtained through the cost-effective squeeze-casting technology processes. For microstructure and properties of the Mo / Cu composites were investigated. For the electronic packaging applications, Mo / Cu composites with volume fractions of 55% -67% Mo were fabricated by the patented squeeze-casting technology. The results show that Mo particles are homogeneous and uniformly, and the Mo-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the Mo / Cu composites are higher than 99%. The mean linear coefficients of thermal expansion (20-100 ° C) of Mo / Cu composites range from 7.9 to 9.3 × 10-6 / ° C and decrease with increasing volume fraction of Mo. The experimental coefficients of thermal expansion agree well with with predictive values ​​based on Kerner’s model. The thermal and electric conductivities of Mo / Cu composites are in range of 220-270 W / (m ° C) and 22-28 MS / m, respectively, and decrease with increasing volume fraction of Mo. The achievement of higher thermal and electric conduction is attributed to the full densitie s and high purity, which are obtained through the cost-effective squeeze-casting technology processes.