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用磁控溅射法在硅基材料上制备TaN薄膜,用原子力显微镜(AFM)和X射线衍射仪(XRD)研究不同工艺下磁控溅射TaN薄膜的表面形貌和组织,用纳米压痕仪和CHI电化学分析仪测试薄膜的力学性能和耐腐蚀性能。结果表明,基底加热和退火处理均导致TaN薄膜组织发生六方结构TaN(110)向面心立方结构TaN(111)和TaN(331)的转变。另外,基底加热和退火处理工艺均改善了TaN薄膜的显微硬度和膜基结合力等力学性能,其断裂韧性和耐腐蚀性能有所降低。
TaN thin films were prepared by magnetron sputtering on silicon-based materials. The surface morphology and microstructure of TaN films by magnetron sputtering were studied by atomic force microscopy (AFM) and X-ray diffraction (XRD) Instrument and CHI electrochemical analyzer test film mechanical properties and corrosion resistance. The results show that the substrate heating and annealing both cause the transformation of TaN (110) to TaN (111) and TaN (331) in the TaN thin film. In addition, the substrate heating and annealing process have improved the mechanical properties of the TaN film such as microhardness and film-based bonding strength, the fracture toughness and corrosion resistance decreased.