论文部分内容阅读
随着微波集成电路的广泛应用,解决生产集成电路基片的加工问题显得更加重要.电子工业部第十研究所经几年努力,研制成功CF-250A型超声设备.该设备除用于加工微波集成电路的高铝陶瓷基片外,也可用于加工厚度较薄的其它脆性材料. CF-250A型超声加工设备于1985年研制成功,同年5月通过技术鉴定,并投入小批量生产.设备的主要技术指标为 工作频率 20kHz;最大输出功率250W; 进给 力灵敏度 ≤200g(约2N)
With the widespread use of microwave integrated circuits, to solve the processing problems of the production of integrated circuit substrate is even more important.Department of Electronics Industry Research Institute after several years of hard work, the successful development of CF-250A-type ultrasonic equipment.The device is used in processing microwave Integrated circuit of high aluminum ceramic substrate, but also can be used for processing other thin brittle materials. CF-250A ultrasonic processing equipment developed in 1985, the same year in May through the technical appraisal, and put into small batch production. The main technical indicators for the working frequency of 20kHz; maximum output power of 250W; feed force sensitivity ≤ 200g (about 2N)