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以甲基三甲氧基硅烷/苯基三甲氧基硅烷为混合硅烷,在硅烷偶联剂(KH-560)作用下混合硅烷经水解缩合后,制得耐高温有机硅树脂。研究结果表明:该硅树脂在N2中失重10%时的温度为385℃,说明其耐热性较好;胶接件的剪切强度随甲基三甲氧基硅烷比例增加而增大;基材表面经KH-560处理后,相应硅树脂/基材胶接件的剪切强度随KH-560含量增加而增大,并且基材为钢片、铝片和玻璃钢片时的剪切强度分别为1.7、1.6、2.3 MPa。
Methyltrimethoxysilane / phenyltrimethoxysilane as a mixed silane, silane coupling agent (KH-560) under the action of mixed silane hydrolysis by condensation, the high temperature silicone resin obtained. The results show that the temperature of the silicone resin at 10% weight loss in N2 is 385 ℃, which shows that the heat resistance of the silicone resin is good. The shear strength of the adhesive increases with the increase of the proportion of methyltrimethoxysilane. The shear strength of the corresponding silicone / substrate adhesive increases with the increase of KH-560 content when the surface is treated with KH-560, and the shear strengths of the substrate with steel, aluminum and glass are 1.7, 1.6 and 2.3 MPa.