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针对互连焊点在长期应力作用下的蠕变失效,探讨了焊点阻值退化的一般性趋势,在此基础上提出了一种基于电阻电桥原理的焊点故障监测和预警电路设计方案,并基于电子产品可靠性保障工程应用,讨论了电路板级互连焊点故障监测和预警电路的实现路径的方法。嵌入式监测电路在电阻缓慢退化阶段和快速退化阶段设置合理的监测起始和终止点,适合对服役中的焊点健康状况进行实时监测和评估。同时,电路具有预警功能,在焊点电性能退化的初期发出预警,并实时采集焊点阻值数据用于焊点剩余寿命的预测,以实现焊点退化的及时预警和退化焊点剩余寿命的预计。
Aiming at the creep failure of interconnect solder joints under long-term stress, the general trend of solder joint resistance degradation is discussed. Based on this, a design scheme of solder joint fault monitoring and warning circuit based on resistor bridge is proposed , And based on the application of reliability assurance of electronic products, discusses the ways to realize the circuit of circuit board level solder joint fault monitoring and warning circuit. The embedded monitoring circuit sets reasonable starting and stopping points of monitoring during slow degradation and rapid degeneration of resistance, which is suitable for real-time monitoring and evaluation of the health status of solder joints in service. At the same time, the circuit has an early warning function, early warning of the electrical properties of the solder joints degenerated, and real-time acquisition of solder joint resistance data for the remaining life of the solder joint prediction in order to achieve timely warning solder joint degradation and degradation of the remaining life of the solder joint Expected.