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为了拓展半导体激光器在激光加工领域的应用范围,使其能够应用到厚板金属材料的焊接中,采用了Laserline公司研制的LDF4000-40光纤耦合半导体激光焊接系统,研究了其厚板SUS304奥氏体不锈钢的焊接性能。实验结果表明,其厚板SUS304奥氏体不锈钢焊接过程中完全能够形成匙孔效应,具有较强的穿透能力;相比于同等工作条件下的光纤激光,其焊接熔深有所减小,而焊接熔宽有所增加;焊缝成型及焊接过程稳定性要优于光纤激光,飞溅量明显小于光纤激光。由此证实了光纤耦合半导体激光器完全可以用于厚板金属材料的焊接。
In order to expand the application range of semiconductor laser in the field of laser processing, it can be applied to the welding of thick plate metal materials. The LDF4000-40 fiber-coupled semiconductor laser welding system developed by Laserline was used to study the effect of the austenite Stainless steel welding performance. The experimental results show that the thick SUS304 austenitic stainless steel can form the keyhole effect completely during welding, and has a strong penetration ability. Compared with the fiber laser under the same working condition, the welding penetration depth is reduced, While the welding weld width increases; the stability of the weld formation and welding process is better than the fiber laser, the amount of spatter is significantly less than the fiber laser. This shows that the fiber-coupled semiconductor laser can be completely used for welding thick plate metal.