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半导体器件引线镀锡或镀铅锡合金,可节约大量的黄金,成本低廉,而且可焊性良好,优于镀金引线.试验证明,镀锡或镀铅锡合金是解决半导体器件引线可焊性的问题的可取途径.本文就我厂在这方面所做的一些工作做一些简单的讨论.
Tin lead-plated semiconductor devices or lead-tin alloy can save a lot of gold, low cost, but also good solderability, better than the gold-plated leads.Experiments show that tin or tin-plated tin solder is solderable semiconductor device leads The problem of the desirable way.This article on my plant in this area to do some of the work to do some simple discussions.