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采用热压扩散焊接法制备了Ti/Cu层状复合材料,并通过SEM、EDS、四电子探针及万能材料试验机等分析测试手段对样品的微观结构和性能进行表征。结果表明,热压扩散焊接法在焊接温度800℃、压力3.5 MPa时,随保温时间的增加,扩散层厚度逐渐增厚;不同保温时间下均生成4个亚层,各亚层金属间化合物依次为Cu4Ti、Cu4Ti3、CuTi、CuTi2;在保温时间为60 min时,复合材料有最小的电阻率(3.634×10-8Ω·m),仅为纯钛的8.65%;复合材料的抗弯曲性能随扩散层厚度的增加而增加。
The Ti / Cu layered composites were prepared by hot-press diffusion welding. The microstructures and properties of the samples were characterized by SEM, EDS, four-electron probe and universal testing machine. The results show that the thickness of diffusion layer increases with the increase of holding time at 800 ℃ of welding temperature and 3.5 MPa of pressure, and four sub-layers are formed at different holding time. The intermetallic compounds Cu4Ti3, CuTi and CuTi2, respectively. When the holding time was 60 min, the composite had the lowest resistivity (3.634 × 10-8Ω · m), only 8.65% of that of pure titanium. The thickness of the layer increases with increasing thickness.