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离子镀是应用于膜沉积工艺的一个常用术语。在该工艺中,基材表面和/或沉积膜受到高能粒子流的作用,足以导致在界面区域或膜与未经轰击沉积情况相比诸多性质的改变。离子镀正是取代溅射沉积、真空蒸发和电镀的一种涂层新工艺。为了对各种沉积技术恰当地选用,有必要了解有关离子镀的基本机理。该文评述了当采用离子镀时,低能离子轰击对表面、界面的形成以及膜的生长的影响。离子镀的许多问题目前仍不明确,因而希望通过呼吁引起对这些问题的重视,科研工作者和工艺学家们能把较多的精力投向研究和控制离子镀工艺。
Ion plating is a common term used in the film deposition process. In this process, the surface of the substrate and / or the deposited film is subjected to a stream of energetic particles sufficient to cause a number of property changes in the interface region or film compared to the case of non-bombarded deposition. Ion plating is to replace the sputtering deposition, vacuum evaporation and electroplating a new coating process. In order to properly select a variety of deposition techniques, it is necessary to understand the basic mechanism of ion plating. This article reviews the effects of ion bombardment on surface and interface formation and membrane growth when ion plating is used. Many of the issues with ion plating are still not clear at this time, and hopefully, by appealing for attention to these issues, researchers and technologists are able to devote more time to studying and controlling the ion plating process.