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基于实际应用,介绍了半导体设备真空结构和真空室常用部件,讲述了He质谱检漏仪的使用方法。总结了真空检漏的经验,阐述了微漏难检的现状。分析了磁控溅射台和ICP真空故障,采用静压检漏法和He质谱检漏仪检漏法,给出了零部件微漏导致这些设备抽不上高真空的结论。指出今后的发展方向是真空部件小型化,以及根据设备特点来提高真空部件的可靠性。结果表明,先排除干扰因素,再细心检漏,可大大提高检漏效率,使设备尽快恢复正常。
Based on the practical application, the vacuum structure of semiconductor devices and common components of vacuum chamber are introduced. The usage of He mass spectrometer leak detector is introduced. Summarizes the experience of vacuum leak detection, elaborates the current situation of leak detection. The magnetron sputtering station and ICP vacuum fault were analyzed. The results of static pressure leak test and He mass spectrometer leak detector showed that the leakage of these components led to the conclusion that these devices could not pump high vacuum. Pointed out that the future direction of development is the miniaturization of vacuum components, and according to the characteristics of the device to improve the reliability of vacuum components. The results show that the first rule out interference factors, and then careful leak detection, can greatly enhance the leak detection efficiency, so that the device back to normal as soon as possible.