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1.材料要求随着电子工业的发展,铜作为输电媒介物,人们对其导电性的重视已超出了所谓“电线”的范畴,要求其同时具有一定的强度、耐热性、电镀性能、软钎焊特性、成形加工性、弯曲特性、与树脂反应性能(密合性、耐蚀性)、耐氧化性、耐气候变化性能等复合性能。特别是强度特性的提高,对部件的小型化、高集成化或提高部件的安装性能,是必不可少的,目前所进行的铜材技术革新,就是让其既不失其导电性,又增强其强度。
1 material requirements With the development of the electronics industry, copper as a transmission medium, people pay more attention to its conductivity beyond the so-called “wire” category, requiring it at the same time have some strength, heat resistance, electroplating performance, soft Brazing characteristics, formability, bending properties, and resin properties (adhesion, corrosion resistance), oxidation resistance, weather resistance and other composite properties. In particular, the improvement of the strength characteristics is essential for the miniaturization and high integration of components and the improvement of the mounting performance of the components. At present, the technological innovation of the copper materials is to make them not only lose their conductivity but also enhance their electrical conductivity Its strength.