在微电子组装技术(指高密度表面组装技术)中,芯片载体已经成了不可缺少的基础元件之一。早在1977年美国就制订了芯片载体的JEDEC标准(1),1980年又作了修订(7)。其他发达国家也相继应用了芯片载 In microelectronic assembly technology (refers to the high-density surface mount technology), chip carrier has become an indispensable one of the basic components. As early as 1977, the United States established the JEDEC standard for chip carriers (1), which was revised in 1980 (7). Other developed countries have also applied the chipset