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脉冲电镀(Pulse Plating)是正在发展的一项新工艺,即采用周期地被一系列开路(此时无电流)所中断的单向电流进行电沉积的过程。其特点是可提高阴极电化学极化(Δφ电),降低浓差极化(Δφ浓),从而改善镀层的物理与化学性能。为提高航天产品上电子元器件在浓盐雾、高湿热环境条件下的耐腐蚀性,延长使用寿命,我们采用航天部标准化所研制的MD-2型脉冲电源进行系统的镀金工艺试验与批生产。结果证明脉冲镀金有以下特
Pulse Plating is a new process that is being developed for electrodeposition using a unidirectional current that is periodically interrupted by a series of open circuits (no current flow at this time). Its characteristic is to improve the cathode electrochemical polarization (Δφ electricity), reduce the concentration polarization (Δφ concentration), thereby improving the physical and chemical properties of the coating. In order to improve the corrosion resistance and prolong the service life of the electronic components of aerospace products under the conditions of heavy salt mist, high humidity and heat, we use the MD-2 pulse power developed by the Ministry of Aeronautics and Astronautics to carry out the systematic gold plating process test and batch production . The results show that the following special pulse gold plating