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微电子组装的大部份工艺开发都要求将元件做到更小,以便在尺寸日益缩小的便携式设备上实现更多功能。阐述了大元件的底部填充,即一侧的尺寸超过15mm,底部填充的胶量介于30～50mg。大尺寸晶元的制造工艺要求比现有生产线更大的产能,这就给底部填充点胶带来更大的挑战。大元件的产能超过3000个/h时,需要点胶机点出非常多的胶水。如此多的胶水在出胶前通过点胶阀,这将会带来加热的问题-某些工艺要求出胶前胶水必须要加热。这会对胶点尺寸有影响,因为随着温度的变化,底部填充的胶水黏度也会随之变化,从而轻微影响点出的胶量。从而将影响晶元相邻的“非沾染区”。稳定的温度是点胶稳定性的保证,并且能帮助胶水流进晶元下方同时也有助胶水分离从而更容易喷射出来。从研究中可以观察到:系统温度环境(点胶机内部)对点胶的胶水质量有影响。
Most process development for microelectronics assembly requires that components be made smaller to enable more functionality on increasingly smaller portable devices. Illustrates the underfill of large components, that is, one side of the size of more than 15mm, the bottom of the amount of glue filled between 30 ~ 50mg. Large-scale wafer manufacturing process requires more capacity than the existing production line, which gives the bottom filler dispensing a greater challenge. Large components capacity of more than 3000 / h, dispensers need to point out a lot of glue. So much glue passes through the dispense valve before it is dispensed, which will raise the problem of heating - some processes require that the glue be heated before it is dispensed. This can have an effect on the size of the gel point, as the viscosity of the underfilled glue changes as the temperature changes, slightly affecting the amount of glue being dispensed. Which will affect adjacent “non-contaminated zone” of the wafer. Stable temperature is a guarantee of dispensing stability, and can help glue flow below the wafer while also helping glue separation and thus easier to spray out. From the study, it can be observed that the system temperature environment (inside the dispenser) has an effect on the quality of the glue applied.