Damage mechanisms during lapping and mechanical polishing CdZnTe Wafers

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CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embed-ded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.
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