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对不同Zn含量的Sn Zn Cu系焊料开展研究,系统研究Zn含量对Sn Zn Cu系无铅焊料合金力学性能、铺展性能以及焊接界面的影响。实验结果表明:随着Zn含量提高,焊料的铺展面积性和力学性能也得到提高;同时会使得钎焊界面处金属间化合物厚增大,降低焊接性能。
The study of Sn Zn Cu solder with different Zn content systematically studied the effect of Zn content on the mechanical properties, spreading performance and interface of Sn-Cu-Cu lead-free solder alloy. The experimental results show that with the increase of Zn content, the spreading area and mechanical properties of the solder are also improved. At the same time, the thickness of the intermetallic compound at the brazing interface is increased and the welding performance is reduced.