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研究预镀1%铬金刚石颗粒表面化学镀铜的预处理工艺、镀液成分和工艺参数对表面形貌、沉积效率、镀层均匀性等的影响,优化出最佳工艺参数。结果表明,采用20%NaOH溶液处理30 min后,再在SnCl2溶液中进行5 min敏化和在PbCl2溶液中进行20 min活化,能提高预镀1%铬金刚石颗粒表面镀铜质量,并获得较高的铜沉积率。化学镀铜最佳工艺条件为:16 g/L CuSO4·5H2O,35 mL/L甲醛,23 g/L酒石酸钾钠,温度60°C,pH=13,辅助超声加(350±15)r/min的机械搅拌。采用此工艺在预镀1%铬金刚石颗粒表面获得了厚度均匀的纯铜层。
The effects of pretreatment process, plating bath composition and process parameters on surface morphology, deposition efficiency, coating uniformity and so on, were studied to optimize the optimal process parameters. The results showed that sensitization with 20% NaOH solution for 30 min, sensitization in SnCl2 solution for 5 min and activation in PbCl2 solution for 20 min could increase the copper plating quality on the surface of 1% chromium carbide particles. High copper deposition rate. The optimal conditions of electroless copper plating were as follows: 16 g / L CuSO4 · 5H2O, 35 mL / L formaldehyde, 23 g / L potassium sodium tartrate, temperature 60 ° C, pH = 13, min of mechanical stirring. Using this process, a uniform thickness of pure copper layer was obtained on the surface of pre-plated 1% chromium diamond particles.