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在第十六届杭州ICTC 2008展上,海思现场发布并展示了业界最佳性价比全系列机顶盒芯片解决方案,其中包括:双向多功能DVB-C芯片Hi3110E(产品内部代号X5)、DVB/IP双模芯片Hi3560Q、经济型DVB-C芯片Hi3109
At the 16th Hangzhou ICTC 2008, HiSilicon released and demonstrated the industry’s best price / performance full range of set-top-box chip solutions including: Bidirectional Multi-Function DVB-C Chip Hi3110E (Product Internal Code X5), DVB / IP Dual-mode chip Hi3560Q, economical DVB-C chip Hi3109