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设计了一款高密度、高可靠性的三联对称式三电平IGCT相模块,其电气、压装、冷却被一体化高度集成,解决了多重平板型半导体器件压装、高压低电感柔性母排连接、高效冷却管网布局等技术难题;其换流路径对称,杂散电感可控制在120nH以内。试验结果表明,该相模块的输出达2000A(rms)/4840V(DC),可将单传动变流器容量提升至11MVA。
A high density and high reliability triple quadrupole IGCT module has been designed. Its electrical, press fit and cooling are highly integrated to solve the problem of multi - plate type semiconductor device press - fit, high voltage and low inductance flexible busbar Connection, efficient cooling pipe network layout and other technical problems; the commutation path symmetry, stray inductance can be controlled within 120nH. The test results show that the phase module output of 2000A (rms) / 4840V (DC), single drive converter capacity can be increased to 11MVA.