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论文主要以表面贴装技术的发展和回流焊焊接温度曲线对焊接装配的质量产生影响为研究点入手,针对焊接不良原因,提出具体提高和改进加工质量和产品的可靠性的一些方法,从而保证产品良好的加工质量和可靠性。
The thesis mainly focuses on the development of surface mount technology and the effect of reflow soldering temperature curve on the quality of the soldering assembly. As to the reason of poor soldering, some methods to improve and improve the processing quality and the reliability of the product are proposed. Good product quality and reliability of the product.