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通过观察焊点的电阻变化和显微组织演变,研究了电流密度对Sn3.0Ag0.5Cu焊点蠕变行为的影响。结果表明:焊点在低电流密度条件下蠕变时,其电阻波动大、寿命长,失效机制由蠕变过程主导,损伤逐渐累积导致最终失效;焊点在高电流密度条件下蠕变时,其电阻波动小、寿命短,电迁移作用缓解了焊点的初期蠕变损伤,但是加速了焊点后期脆性断裂失效。
The effect of current density on the creep behavior of Sn3.0Ag0.5Cu solder joints was investigated by observing the resistance changes and the microstructure evolution of the solder joints. The results show that when the solder joint creeps at low current density, its resistance fluctuates greatly and its service life is long. The failure mechanism is dominated by the creep process. The damage gradually accumulates and leads to the final failure. When the solder joint creeps under high current density, The resistance fluctuation is small, life is short, the role of electromigration ease the initial creep damage, but accelerated the late brittle fracture failure.