在封装的舞台上,三维集成技术因为在提高电子系统的性能和微型化方面效果卓著而引起重视。目前三维技术的手段一般采用较长的焊线来连接堆叠芯片和基层。新的三维概念仍处在开发阶段,但它将提供更短的互联,更高的互联密度,更低的成本。对于不同的应用,需要有相应且适宜的3D技术。 On the packaging arena, 3D integration is gaining prominence because of its effectiveness in improving the performance and miniaturization of electronic systems. At present, the means of three-dimensional technology generally use longer bonding wires to connect the stacked chips and the base layer. The new three-dimensional concept is still under development, but it will provide shorter interconnects, higher interconnect density and lower costs. For different applications, corresponding and appropriate 3D technology is needed.