论文部分内容阅读
本文介绍了自动带焊（ＴＡＢ）器件的载带结构，分析和计算出载带的电参数，构造了集中参数的等效电路，对ＴＡＢ器件和引线键合器件的高频特性用ＰＳＰＩＣＥ程序进行了分析，通过比较，阐明了ＴＡＢ器件在高频特性上优于传统封装形式．
This paper introduces the carrier tape structure of TAB device, analyzes and calculates the electrical parameters of the carrier tape, and constructs the equivalent circuit of the centralized parameters. The high frequency characteristic of TAB device and wire bonding device is carried out by PSPICE program The analysis shows that the TAB device outperforms the traditional package in terms of high frequency characteristics by comparison.