Field emission-scanning electron mieroscopy(FE-SEM) technique was employed to observe the shape,size and distribution of AlN+MnS inclusions in oriented electric
Mixed Al-Si, Al-Si-SiC and Al-Si-W powders were employed as insert layers to reactive diffusion bond SiCp/6063 MMC. The results show that SiCp/6063 MMC joints b
Magnetron sputtered (Ti, Al) N monolayer and TiN/(Ti, Al) N multilayer coatings grown on cemented carbide substrates were studied by using energy dispersive X-r
For electronic packaging applications,Mo/Cu composites with volume fractions of 55%-67% Mo were fabricated by the patented squeeze-casting technology. The micro
Cracks and ruptures always occur during wire drawing process of 42% nickel-iron expansive alloy. In order to study the reasons of these phenomena,a method of me