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运用电学法测量功率型LED冷却瞬态温度曲线,通过数学方法将其转化为积分和微分结构函数来分析器件各区域的热阻和热容,结果发现,各层材料的测量值与理论值基本一致。1μs的瞬态数据采集精度和高的重复性保证了实验结果的准确性和可靠性,运用这种方法比较了3种不同金属芯印刷电路板(MCPCB)对功率型LED的散热效果,贝格斯Al基板散热性能最好,ANTAl基板次之,普通Al基板最差。研究表明,利用结构函数分析功率型LED的热特性是一种强有力的方法。
Using the electrical method to measure the transient temperature curve of power LED cooling, the thermal resistance and heat capacity of each area of the device were analyzed mathematically and converted into integral and differential structure functions. The results showed that the measured value and the theoretical value Consistent. 1μs transient data acquisition accuracy and repeatability to ensure the accuracy and reliability of the experimental results, the use of this method to compare the three different metal core printed circuit board (MCPCB) on the power LED cooling effect, Begg Sri Lanka Al substrate best thermal performance, followed by ANTAl substrate, the worst common Al substrate. Research shows that the use of structural function analysis of the thermal characteristics of power LED is a powerful method.