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道康宁公司推出的新型导热灌封胶DOW CORNING(R)SE4451和一种已预先认证的完整点胶流程(turnkey dispensing process),专为满足电子功率组件苛刻的热管理需求而设计,它能同时提高很高的热导系数(25℃时为3 W/mK)
Dow Corning’s new thermal potting compound DOW CORNING (R) SE4451 and a pre-qualified turnkey dispensing process, designed to meet the demanding thermal management needs of electronic power components, can increase both High thermal conductivity (3 W / mK at 25 ° C)