高性能(高组装密度,高速度)和高可靠性是近年来电子设备发展过程中的两大特点。尤其是微电子设备,正在以“双高”为主要目标向前推进。微机处理速度的加快,取决于线路集成度的提高。而运行速度的加快与信号延迟时间和连线长度直接相关。这样一来,就使六十年代开始的每个组件(仅1～2个电路), High performance (high packing density, high speed) and high reliability are two characteristics in the development of electronic equipment in recent years. In particular, microelectronic equipment, is the “double high” as the main goal to move forward. Computer processing speed, depends on the improvement of line integration. The speed of operation is directly related to the signal delay time and connection length. As a result, each component that started in the 1960s (only 1 or 2 circuits)