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在电子组装技术中,清洗占有极其重要地位。SMDs的应用使单位面积印制板上元器件的容量大为增加。典型的SMDs组装密度一般可达到普通元件组装密度的4~6倍。对于由片状电阻,片状电容和无引线芯片(LCCs)组成的SMDs组装件的焊后清洗,实践证明并非有效,这是由SMDs组装件结构特点所决定的。在这种新一代的组装件上,印制板与片状元件之间的空间间隔已达到0.08~0.15mm,以适应组装后进行波峰焊的需要。因此,这种SMDs组装件焊后非常容易产生焊剂残
In electronic assembly technology, cleaning occupies a very important position. The application of SMDs greatly increases the capacity of components on a printed board per unit area. Typical assembly density SMDs generally can reach ordinary assembly density of 4 to 6 times. Post-weld cleaning of SMDs assemblies consisting of chip resistors, chip capacitors and leadless chips (LCCs) has proven to be ineffective due to the structural features of the SMDs assembly. In this new generation of assembly, the space between the printed circuit board and chip components has reached 0.08 ~ 0.15mm, in order to meet the needs of wave soldering after assembly. Therefore, this SMDs assembly after welding is very easy to produce residual flux