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本文叙述的是我们在TTL数字集成电路的浓硼隔离扩散时,硅片上产生的一种“白雾”现象的实验结果,并对产生“白雾” 的成因机理进行探讨,最后提出了解决“白雾”的工艺方法.
This article describes the experimental results of a kind of “white fog” phenomenon on the silicon wafer produced by the concentrated boron isolation and diffusion of the TTL digital integrated circuit and explores the genesis mechanism of “white fog”, and finally proposes the solution “White fog” process.