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天水华天微电子有限公司表面贴装式集成电路封装生产线技改项目,日前通过了由信息产业部电子信息产品管理司和甘肃省经贸委邀请有关部门领导与专家联合组织的项目竣工评审验收,标志着天水华天微电子有限公司已成为我国西部集成电路封装产业化发展的重要基地。公司董事长肖胜利说,争取在2004年使封装能力达到20亿块,销售额达到3亿元以上;2004年～2005年,通过技术攻关和技术改造,切入BGA、CSP、FC、MCM等高阶层封装品种,使封装产能达到30亿块,年销售额达到四、五亿元;2006～2007年,在继续抓技术改造中,使封装产能达到50亿块,年销售额达到六、七亿元;到2010年,争取达到80亿块以上的封装规模和十亿元以上的年销售额。
Tianshui Huatian Microelectronics Co., Ltd. surface mount integrated circuit packaging technology transformation project, recently passed by the Ministry of Information Industry Electronic Information Products Management Division and the Gansu Provincial Economic and Trade Commission invited the relevant departments of the leaders and experts jointly organized the project review and acceptance of the project, Marking the Tianshui Huatian Microelectronics Co., Ltd. has become China’s western integrated circuit packaging industry an important base for the development. Xiao Sheng Li, chairman of the company said that in 2004 to fight to achieve packaging capacity of 2 billion, with sales of more than 300 million yuan; 2004 to 2005, through technological breakthroughs and technological transformation into the BGA, CSP, FC, MCM contour Class packaging varieties, so that packaging capacity reached 3 billion, annual sales reached four, 500 million yuan; 2006 ~ 2007, while continuing to grasp the technological transformation, so that packaging capacity reached 5 billion, annual sales reached six, 700 million Yuan; by 2010, strive to reach more than 80 billion package size and more than one billion yuan in annual sales.