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综述近年来低介电常数聚酰亚胺(PI)材料的研究进展,分为含氟PI及多孔PI两部分,重点讨论了采用化学方法制备低介电常数多孔PI材料的相关研究,并对低介电常数PI材料的研究前景进行了展望。
In this paper, the research progress of low dielectric constant polyimide (PI) materials is reviewed. It is divided into two parts: fluorine-containing PI and porous PI. The related research on the preparation of porous PI with low dielectric constant Prospects for the research of low dielectric constant PI materials are prospected.